| Product type | Rigid , Rigid-Flex , Flex , Metal core ( 1 & 2 L ) , Heavy copper ,Backpanels , IC Test Board sintered boards |
|
| Laminates | FR4 & High Tg , Halogen Free FR4 , Metal base clad , taconic , Arlon Rogers , Kapton. | |
| Max Layer count ( rigid ) | 36 | |
| Max layer count ( flex) | 6 | |
| Flex pcb with stiffener assembly | yes | |
| Min board thickness | 0,254 mm | |
| Max board thickness | 4,45 mm | |
| Min core thickness | 0,0508 mm | |
| Min dielectric thickness | 0,0508 mm | |
| Min starting copper foil weight | 9 um | |
| Max finished copper thickness O/L | 210 um | |
| Max finished copper thickness I/L | 140 um | |
| Maximum panel size | 540x620 mm | |
| Minimum anular ring width | 0,05 mm | |
| Smallest mech. Drill diameter | 0,2 mm | |
| Smallest laser drill diameter | 0,10 mm | |
| Hole size tolerance (NPTH) | + /- 0,05 mm | |
| Hole size tolerance (Laser) | +/- 0,025 mm | |
| Hole size tolerance (PTH) | +/- 0,076 mm | |
| Hole to hole tolerance | +/- 0,05 mm | |
| Copper thickness in hole | 20 / 35 um | |
| Through/Buried holes aspect ratio (mechanical) | 12.01 | |
| Blind holes aspect ratio (Laser) | 0,5:1 | |
| Min Line width Space ( inner 1/2 OZ) | 50/50 um | |
| Min Line width Space ( inner 1 OZ) | 75/75 um | |
| Min Line width Space ( outer 1/2 OZ) | 75/75 um | |
| Impedance control | +/-6% | |
| Via in pad | yes | |
| Stacked vias | yes | |
| Outline tolerance | +/-0,10 mm | |
| Solder mask min opening | 40 um | |
| Solder mask min dam | 50 um | |
| Bow & twist tolerance | 0,5-0,75% | |
| Thickness tolerance | +/-10% | |
| Sequential lam | 3+N+3 (IVH) | |
| Blind & Buried vias | yes | |
| Conductive filled vias | yes | |
| Non conductive filled vias | yes | |
| Surface finishes | HASL , Lead free HASL , OSP , Enig , Immersion Silver , Electrolytic hard gold, Selective gold | |
| Solder masks | Green , Black , Red , Blue , yellow | |
| Countersink | yes | |
| Millingh depth | yes | |
| Edge plating | yes |